Pace ThermoBond Cir-Kit frames incorporate an advanced "dry-film adhesive backing" which is hot-bonded in 15 seconds at safe, low temperatures. This high quality process saves repair time, requires no messy mixing and application of epoxy liquid, and allows fast repair and modification of SMT and Thru-Hole lands, edge connector fingers, and other circuit elements to meet original board quality and reliability.

• SMT ThermoBond Cir-Kit 
• Thru-Hole ThermoBond Cir-Kit
• Combo SMT/Thru-Hole
• ThermoBond Cir-Kit Edge
• Connector Thermobond Cir-Kit