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ALPHA OM-358 is a lead-free, zero-halogen, no-clean solder paste designed to provide ultra-low voiding performance on all component types including bottom termination components. Alpha OM-358 achieves IPC7095 Class III voiding on BGA components and less than 10% voiding on bottom termination components. This paste is designed for ultra-low voiding performance with high reliability alloys such as Innolot as well as traditional SAC alloys.
Benefits
- Ultra-Low Voiding Performance: Increases process stability, thermal, and electrical performance of the most demanding component applications.
- Excellent Electromigration characteristics: Passes J-STD-004B IPC-TM-650 at 100µm to ensure electrical reliability & functionality of fine-pitched components.
- Wide Reflow Profile Window: Enables high quality solderability of complicated, high density PCB assemblies using straight ramp and soak profiles, as high as 150° to 200°C soak.
- Good Random Solder Ball Levels: Minimizes rework and increases first pass yield.
- Good Coalescence and Wetting Performance: Coalesces down to 170µm exhibiting good wetting characteristics and solder joint reliability
- Excellent Solder Joint and Flux Residue Cosmetics: Easily penetrable and clear flux residue enables good probe contact during quality inspection.
- Long, Stable Tack Force Life: Promotes high pick-and-place yields and good self-alignment to minimize rework prior to reflow.
- Zero-Halogen, No Halogens Intentionally Added: Ensures ROHS compliance for a safe and environmentally friendly assembly process.