Statfree Conductive Foam can be used to protect ESD susceptible devices from ESD and physical damage, in a variety of electronics industry applications. Statfree® Conductive Foams are suitable for protection of static susceptible devices and assemblies. Use for shunting of component leads (IC, PCB and other static sensitive components).
High Density: Foam accommodates IC chips, printed circuit boards and other static susceptible electronic devices for lead insertion. When all leads are inserted in foam, terminals are brought to electrical equipotential, and exposure to electrostatic discharge is minimized.
High Density Cross Link: Foam is an IC insertion high grade conductive closed-cell cross linked polyethylene foam. This product exhibits excellent non-sloughing characteristics, so it is an excellent choice for clean and other critical environments.