Note: Solder alloys are priced daily based off of market pricing. If solder is currently priced at $0.00 you can request a quote or continue place your order and the price will be added to the order at the time of processing.
ALPHA UP-78 is a No Clean solder paste with a post-reflow residue that is clear and colorless and is penetrable enough to allow easy ATE compatibility (pin testability). The residue is engineered to be soft and non-tacky to allow the lowest level of false rejects during pin testing. ALPHA UP-78 is designed for stencil application and air reflow in surface mounting processes where post reflow cleaning is not required. Melting point of 63sn/37pb: 183°C