Note: Solder alloys are priced daily based off of market pricing. If solder is currently priced at $0.00 you can request a quote or continue place your order and the price will be added to the order at the time of processing.

ALPHA OM-338’s particle size viscosity makes it suitable for syringe dispensing applications. ALPHA OM-338 is a lead-free, no-clean solder paste designed for a broad range of applications.

ALPHA OM-338’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications.

Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, exceptional random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338 is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA OM-338’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.