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ALPHA OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-340 provides best in class low defect rate for Head in Pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high "through-put" applications.
Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA OM-340’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
No-Clean | Yes |
Powder Size | Type 3, 4, 4.5 |
Metal Loading (% by weights) | 89.0% |
Viscosity Designation (Malcolm @ 10 RPM | M18 |
Flux J-STD 004 Classification | ROL0 |
Halogen Content | None detected |
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