Alpha OM-5300 63Sn/37Pb Particle Size 3 Solder Paste
Alpha OM-5300 was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly. OM-5300 has excellent print volume repeatability to minimize variation in the print process. OM-5300 minimizes print cycle times through high print speeds and extended number of prints between stencil undercleaning. Due to its ability to withstand long, hot soak reflow profiles, OM-5300 allows for better wetting of lead free surfaces with the tin lead paste alloy.
OM-5300's lower "deposit to deposit" variation drives maximization of first pass print and reflow yields. High print deposit volumes and low volume variability allow for fine feature capability down to 12 mil (0.33mm) circle feature sizes.
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