ALPHA UP-78 is a No Clean solder paste with a post-reflow residue that is clear and colorless and is penetrable enough to allow easy ATE compatibility (pin testability). The residue is engineered to be soft and non-tacky to allow the lowest level of false rejects during pin testing. ALPHA UP-78 is designed for stencil application and air reflow in surface mounting processes where post reflow cleaning is not required. Melting point of 63sn/37pb: 183°C

• Long stencil life & stable tack for minimum change in performance over 8 hour shifts under varying humidity exposure.
• Tolerant to a variety of reflow profiles for easy reflow on varying board designs.
• Highly penetrable residue to allow easy ATE compatibility (pin testing) and minimal false fails.
• Clear and colorless residue after reflow for the best board cosmetics.