ALPHA® HiTech™SM42-1311 is ideal for high-speed dispensing process given its non-sagging property. It has been tested to provide excellent adhesion after curing.
Key Features:
- Rheology specially designed for high throughput dispensing process
- Excellent adhesion on common PCB board materials
- Excellent thermal resistance during wave soldering process
- Complies with RoHS Directive 2011/65/EU
- Halogen Free