Techspray - No-Clean Desoldering Braid - ESD Bobbin, 0.055" x 10'

Techspray - No-Clean Desoldering Braid - ESD Bobbin, 0.055" x 10'

1821-10F, Techspray - No-Clean Desoldering Braid - ESD Bobbin, 0.055" x 10'

Techspray - No-Clean Desoldering Braid - ESD Bobbin, 0.055" x 10'

  • 95-1821-10F
  • Techspray
  • 44
  • Ships within 3 Weeks

Desoldering braid (wick) is a copper braid that is used to remove solder which allows components to be replaced and excess solder to be removed. Techspray No­Clean wick does not leave behind ionic flux residues that can collect and form branches called "dendrites". Other fluxes, if not cleaned properly, can cause dendrites that grow over time and eventually cause short circuits between traces or leads Latent failures lead to costly returns and lower the quality perception of your products.  



  • No-clean flux coated braid
  • Cleanest wick - clear, non-reactive residues
  • Will not leave ionic residue - avoid dendrite failure
  • Exceeds MIL-F-14256, Type
  • Anti-static spool (except where indicated)
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