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ALPHA WS-820 is the newest Alpha brand lead free, halide free solder paste offering the ideal combination of printability and reflow profile process window, with excellent cleanability in a lead free alloy solder paste.
FEATURES & BENEFITS
- Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
- Able to spread and wet using straight ramp or soak reflow profiles in air
- High spread/wetting lead free paste compatible with lead free alloys and surface finishes
- High Reflow Yield with IPC Class II Voiding Performance when used to solder BGA components
- Excellent wetting characteristics on all common surface finishes (including Entek HT OSP). JIS Spread 88.6% on Entek HT OSP. leanable with water based cleaning systems