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Alpha - OM-565 HRL3 Particle Size 5 Solder Paste - 500 Gram Jar

Alpha - OM-565 HRL3 Particle Size 5 Solder Paste - 500 Gram Jar

ALPHA OM-565 Solder Paste HRL3 Alloy, 500 gram jar

Alpha - OM-565 HRL3 Particle Size 5 Solder Paste - 500 Gram Jar

  • 10-P271345
  • Alpha
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ALPHA OM-565 HRL3 low temperature solder paste was formulated for a broad range of assemblies to mitigate warpage induced defects in temperature sensitive chip-scale packages. ALPHA OM-565 HRL3 is designed to enable target reflow temperatures of 175 °C with superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HiP). (Available in particle size 4 and 5)

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  • Enables target peak reflow of 175 °C for excellent HiP/NWO performance
  • Mitigates warpage induced defects such as hot tearing for temperature sensitive packages
  • Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability
  • Fine Feature print capability down to 01005 component
  • 8-hour stencil life in ambient and elevated condition 
  • Compatibility with contact and non-contact rework applications 
  • Reflowable in Air and Nitrogen
  • Zero-Halogen