ALPHA’S SLS 65C was specifically developed to eliminate the tendency for solder balling and solder bridging-two defects which are normally associated with the use of the chip wave. Of all low solids (< 4% solids), no-clean fluxes, ALPHA SLS 65C exhibits the lowest tendency for solder ball generation over a wide variety of solder masks. ALPHA SLS 65C should be considered for use by any assembler who has board designs which are sensitive to solder bridging, performs pin testing, and whose specification requires an extremely low frequency of solder balls.

Features and Benefits:

• Thermally stable activators provide the lowest solder bridging in a low solids, no-clean flux.
• Reduces the surface tension between solder mask and solder to provide the lowest solder ball frequency of any low solids, no-clean flux.
• Very low level of non-tacky residue to reduce interference with pin testing and exhibit no visible residue.
• Cleaning is not required which reduces operating costs.
• Bellcore Compliant for long term electrical reliability.