ALPHA NR330, former lab development #9225, is a VOC-free halide-free, rosin/resin-free, low solids no-clean flux which provides the highest activity of any VOC-free Bellcore compliant flux for defect-free soldering. It is formulated with a proprietary mixture of organic activators which deliver excellent wetting and top-side hole fill, even with OSP coated bare copper boards which have undergone prior thermal excursions. Several proprietary additives are also formulated into ALPHA NR330 which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation. The formulation of ALPHA NR330 is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.

Features and Benefits

• Bellcore compliant for assemblies requiring this standard.
• VOC-free to help meet air quality regulations.
• Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows.
• Thermally stable activators provide low solder bridging.
• Reduces the surface tension between solder mask and solder to provide low solderball frequency.
• Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics.
• Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag.